二相流冷却装置及び二相流冷却装置用蒸発器

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专利权人:

富士通株式会社

发明人:

脇野 有希子,米田 泰博

申请号：

JP20130163133

公开号：

JP6123555(B2)

申请日:

2013.08.06

申请国别(地区):

日本

年份:

2017

代理人:

摘要：

PROBLEM TO BE SOLVED: To provide a two-phase flow cooling device and an evaporator for the two-phase flow cooling device for preventing damage of a semiconductor device due to overheat when failure occurs.SOLUTION: A thermal deformation radiation fin, which is changed from a compression state to an expansion state when temperature of the fin reaches prescribed temperature or more, is disposed at an apex part of a housing for evaporation.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/