A contact assembly for electrically interconnecting at least two modules is disclosed. The contact assembly has a first module having a first contact pad and a second module having a second contact pad. The first and second contact pads are arranged nonparallel to one another. One of the first and second contact pads exerts pressure on an electrically conductive elastomer to thereby deform it, and the deformation results in the other one of the first and second contact pads being contacted by the electrically conductive elastomer. An electrochemical sensor may be part of the first module and an electronics assembly may be part of the second module. An insertion needle may also be provided to insert the sensor transcutaneously. Associated methods are disclosed.
