Debondable adhesive system

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专利权人:

发明人:

申请号：

EP15000461.2

公开号：

EP3056225A1

申请日:

2015.02.16

申请国别(地区):

EP

年份:

2016

代理人:

摘要：

The present invention relates to an adhesive system comprising a debondable adhesive layer and a hydrocolloid adhesive layer. The debondable adhesive layer can be in direct physical contact with the hydrocolloid adhesive layer, or a water permeable layer can be interposed between the debondable adhesive layer and the hydrocolloid adhesive layer to provide partial or complete physical separation of the two adhesive layers. The adhesive system is particularly suited for attaching and removing medical devices to and from the skin of a patient. The invention also relates to medical devises comprising the adhesive system.

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中国工程科技知识中心

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http://www.ckcest.cn/home/