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SYSTEMS AND METHODS FOR IMPLANTING A MEDICAL ELECTRICAL LEAD
专利权人:
Inc.;Medtronic
发明人:
Melissa G.T. Christie,Amy E. Thompson-Nauman,Noah D. Barka,Rick D. McVenes
申请号:
US14257519
公开号:
US20140330208A1
申请日:
2014.04.21
申请国别(地区):
US
年份:
2014
代理人:
摘要:
Devices and implantation methods utilizing subcutaneous placement into a patient are disclosed for the insertion, advancement and positioning of a subcutaneous implantable medical device (SIMD) such as a medical electrical lead. The device for implanting the SIMD is configured having a pre-biased distal curve for creating a pathway to an implant location within a substernal space.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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