HEADER FOR A MEDICAL IMPLANT DEVICE, PARTICULARLY FOR A PACEMAKER

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专利权人:

BIOTRONIK SE & Co. KG

发明人:

Martin Henschel,Jan Litzke

申请号：

US15489874

公开号：

US20170310059A1

申请日:

2017.04.18

申请国别(地区):

US

年份:

2017

代理人:

摘要：

A header for a medical implant device is configured to provide an electrical connection to a circuit within the housing of the medical implant device. The header includes at least one circuit board； a header housing enclosing the circuit board and configured to be connected to the housing of the medical implant device； and a sensor system on the circuit board.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/