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SOUND PROCESSOR INTERCONNECTS, HEADPIECE ASSEMBLIES, AND METHODS OF MAKING THE SAME
专利权人:
Advanced Bionics AG
发明人:
Manish Vaishya,Scott A. Crawford
申请号:
US14129526
公开号:
US20140200645A1
申请日:
2011.08.05
申请国别(地区):
US
年份:
2014
代理人:
摘要:
An interconnect for connecting a sound processor to a headpiece and headpiece assemblies including the same. The interconnect comprises: a plug (236) including a center conductor (246), an outer conductor (242) and a crimp body (248); a coaxial cable (202) including a center conductor and an outer shield positioned over the crimp body (248); a ferrule (240) crimped to the crimp body with the outer shield there between; and a crimp pin (238) crimped to the cable center conductor and secured to the plug center conductor (246).
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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