Low expansion plate used for semiconductor device, includes plane perforated plate made of low expansion material in which through-holes are formed, and metal member filling the respective through-holes
A low expansion plate comprises: (i) a plane perforated plate (6, 10) made of low expansion material in which through-holes are formed; and (ii) a metal member filling the inside of the respective through-holes of the perforated plate and surrounding both surfaces of the perforated plate. A low expansion plate comprises: (a) a plane perforated plate made of low expansion material in which through-holes are formed; and (b) a metal member filling the inside of the respective through-holes of the perforated plate and surrounding both surfaces of the perforated plate. On at least one or both surfaces of the metal member, one of a concave portion (8) and a convex portion (9) being formed in each portion corresponding to each of the through-holes of the perforated plate while the outer of the concave portion and the convex portion being formed in each portion corresponding to an area other than the through-holes of the perforated plate, all the convex portions being identical in thermal expansion coefficient in a plate thickness direction. An Independent claim is also included for a method of manufacturing a low expansion plate comprising arranging a planar metal plate on surfaces of a planar perforated plate made of low expansion material; arranging a protective ember on the metal plates; pressurizing the protective members; and removing the protective members from the outer surfaces of the metal plates.
