IMPLANTABLE MEDICAL DEVICE WITH MODULAR INJECTION MOLDED HEADER ASSEMBLY AND RELATED METHODS OF MANUFACTURE

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专利权人:

发明人:

Wisit Lim,Reza Imani,Brett Villavicencio,Mitch Goodman

申请号：

US15073294

公开号：

US20170266451A1

申请日:

2016.03.17

申请国别(地区):

US

年份:

2017

代理人:

摘要：

Disclosed herein is an implantable electronic device. In one embodiment, the device has a modular header-feedthru assembly and a housing. The modular header-feedthru assembly has a conductor assembly, a feedthru coupled to the conductor assembly, and a polymer header that is injected molded about the conductor assembly and at least a portion of the feedthru. The housing is welded to the feedthru.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/