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Patch
专利权人:
久光製薬株式会社
发明人:
前田 浩幸,鴫石 正和,柏倉 友美
申请号:
JP2014203481
公开号:
JP6336368B2
申请日:
2014.10.01
申请国别(地区):
JP
年份:
2018
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide a patch in which a microspike array device does not cause a site gap below a cover material in the state where it is attached to the skin.SOLUTION: A patch 10 according to the invention comprises a microspike array device 12 and a cover material 14. The microspike array device 12 comprises a basal plate 16, and a plurality of microspikes 18 arranged at one face of the basal plate in which the surface of the microspike is coated with an active ingredient. The cover material 14 comprises a base material 20, and an adhesive layer 22 formed on one face of the base material in which another face of the basal plate is attached to the adhesive layer so as to cover the microspike array device. The cover material is characterized in that the elasticity in a first direction T is lower compared with the elasticity in a second direction L which is perpendicular to the first direction.SELECTED DRAWING: Figure 1
来源网站:
中国工程科技知识中心
来源网址:
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