Barry, Patrick J.,White, Randy,Kubow, Steven A.,Spadgenske, Scott A.,Chizek, David A.,Sauber, Jerald
申请号：
AU2016243089
公开号：
AU2016243089B2
申请日:
2016.03.24
申请国别(地区):
AU
年份:
2018
代理人:
摘要：
An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.
