An intervertebral implant for mounting between superior and inferior vertebrae includes first and second endplates and an inlay. The first endplate has a first vertebra engagement surface and a first inner surface. The first vertebra engagement surface is mounted to the superior vertebra in an implant positions. The second endplate has a second vertebra engagement surface and a second inner surface. The second vertebra engagement surface is mounted to the inferior vertebra in the implanted position. The inlay is mounted to and between the first and second inner surfaces in an assembled configuration. The inlay includes a first mounting plate, a second mounting plate, a first W-shaped spring and a second W-shaped spring. The first and second W-shaped springs are mounted between the first and second mounting plates. The first and second W-shaped springs have longitudinal axes that are generally parallel to the insertion axis.
