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Header assembly for implantable medical device
专利权人:
Andrew J. Ries;Jean-Francois Fischer;David B. Engmark;John E. Kast
发明人:
Andrew J. Ries,David B. Engmark,John E. Kast,Jean-Francois Fischer
申请号:
US12696931
公开号:
US09403022B2
申请日:
2010.01.29
申请国别(地区):
US
年份:
2016
代理人:
摘要:
An implantable medical device includes a housing; at least one module enclosed within the housing and configured to at least one of generate an electrical stimulation therapy for delivery to a patient or monitor a physiological parameter of the patient; one or more feedthroughs extending through the housing; a header assembly including one or more electrical connectors electrically coupled to the module via the feedthroughs; and a preformed gasket compressed between the housing and the header assembly forming a seal to electrically isolate the feedthroughs from an external environment.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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