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BIOCOMPATIBLE PACKAGING FOR LONG TERM IMPLANTABLE SENSORS AND ELECTRONICS
专利权人:
发明人:
申请号:
EP16773748.5
公开号:
EP3277158A1
申请日:
2016.03.21
申请国别(地区):
EP
年份:
2018
代理人:
摘要:
An implantable medical device is described. In an example, the implantable medical device includes an electromechanical substrate and sensor, such as a pressure sensor, disposed on the substrate. At least a portion of the sensor is packaged via a liquid encapsulation. The packaging includes a shaped flexible outer membrane that surrounds at least the portion of the sensor. The packaging also includes a hydrophobic liquid disposed between at least the portion of the pressure sensor and the flexible outer membrane. The implantable medical device can be a part of a medical system used for monitoring medical conditions or performing medical operations based on the implantable medical device. Additionally, manufacturing methods are described for packaging the sensor in a liquid encapsulation.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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