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超音波デバイス、超音波プローブ、電子機器および超音波画像装置
专利权人:
セイコーエプソン株式会社
发明人:
大西 康憲
申请号:
JP2013012946
公开号:
JP6212870B2
申请日:
2013.01.28
申请国别(地区):
JP
年份:
2017
代理人:
摘要:
Provided is an ultrasonic device including: an ultrasonic element array substrate having a plurality of ultrasonic elements that each include a piezoelectric body an acoustic lens secured via an acoustic matching layer to a surface, formed with the ultrasonic elements, of the ultrasonic element array substrate and a support member secured to a surface, opposite to the surface formed with the ultrasonic elements, of the ultrasonic element array substrate, wherein the support member is formed to have a larger area, in plan view in the thickness direction of the ultrasonic element array substrate, and a higher bending stiffness than the ultrasonic element array substrate, and the acoustic lens is formed to have a lower bending stiffness than the ultrasonic element array substrate. The above-described ultrasonic device further includes an acoustic matching layer filled between the ultrasonic element array substrate and the acoustic lens.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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