Fletcher R. Rothkopf,Teodor Dabov,Richard Hung Minh Dinh,Jun Sun,Michael Rosenblatt
申请号：
US12150684
公开号：
US08111522B2
申请日:
2008.04.29
申请国别(地区):
US
年份:
2012
代理人:
摘要：
An electrical contact area on a printed circuit board (“PCB”), that would otherwise be subject to abrasion and possibly also corrosion, can be protected by covering it with another, more durable contact structure that is bonded to the first-mentioned contact area using an anistropic conductive adhesive (“ACA”). The more durable contact structure may include a member of PCB material or the like with electrically connected electrical contacts on its upper and lower surfaces. At least the upper one of these contacts (which is exposed for the service that involves possible abrasion and/or corrosion) may be given high durability by plating it with hard gold. The lower of these contacts is adhered to the main PCB via the above-mentioned ACA.
