Disclosed is a cloth and solid piece assembly, which comprises a cloth which is subjected to an embossing process to have a receiving portion formed through the embossing process in such a manner as to protrude from a surface of the cloth in a direction perpendicular to the surface to have an opening oriented in a direction opposite to the protruding direction, a solid piece received inside the receiving portion, and an adhesive material. The adhesive material is received inside the receiving portion and bonded to an inner peripheral surface of the receiving portion while plugging the opening of the receiving portion, so as to fix the solid piece inside the receiving portion. The cloth and solid piece assembly can reliably suppress peeling of a bonded region between the adhesive material and the cloth, in a simple structure.
