A kit of surgical instruments for bone repair includes a set of sizer instruments, a set of drill bits for bone boring and a set of guide instruments. The sizer instruments are defined by bodies of varying diameters. The drill bits have varying diameters that correspond to the sizer instruments. The guide instruments are defined by thin-walled cylindrical bodies of varying diameters that correspond to the diameters of the sizer instruments and drill bits. Each cylindrical body includes an open proximal end and an open distal end and has an inner cylindrical surface sized to provide for translating movement of a corresponding sizer instrument and drill bit instrument therethrough. In one embodiment, the sizer instruments, the drill bits and the guide instruments of the kit each have a feature that is color coded to provide a visual indication of corresponding sized instruments of the kit. In another embodiment, each given drill bit has a plurality of distal surfaces that are oriented in respective planes that are substantially transverse to the central axis of the given drill bit such that given drill bit cuts a hole into bone wherein the hole has a substantially flat bottom surface. In yet another embodiment, each given guide instrument includes at least one window in the cylindrical body that provides for visualization into the interior space of the given guide instrument during use. Methods of bone repair using the kit is also disclosed and claimed.
