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無電解スズメッキ被膜表面の洗浄液およびその補給液、ならびにスズメッキ層の形成方法
专利权人:
メック株式会社
发明人:
柴沼 祐子,伍田 竜矢,仁頃 丈二郎,市橋 知子,上甲 圭佑,山田 崇弘,天谷 剛
申请号:
JP20140263252
公开号:
JP6078525(B2)
申请日:
2014.12.25
申请国别(地区):
日本
年份:
2017
代理人:
摘要:
The present invention relates to: a washing solution for a tin plating film, which can be used for washing in advance of the washing with water after electroless tin plating; and a method for forming a tin plating layer, which includes a step of washing with the washing solution. The washing solution according to the present invention is an acidic aqueous solution containing an acid, a complexing agent, a stabilizer and a chloride ion. The washing solution contains the chloride ion at a concentration of 2% by weight or more, and also contains tin at a concentration of 0.5% by weight or less. The washing solution according to the present invention has good washing performance against the surface of a tin plating film, can maintain the properties of the tin plating film readily, has a small influence on the surface of the plating film even when used continuously, and has excellent long-term stability.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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