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Dispensing packages for medical devices having two components that are mechanically interlocked and methods therefor
专利权人:
Denise Marie Dacey
发明人:
Denise Marie Dacey,Jonathan William Gillespie
申请号:
US12820344
公开号:
US08517174B2
申请日:
2010.06.22
申请国别(地区):
US
年份:
2013
代理人:
摘要:
A package for a flat medical implant includes a flexible outer component, such as Tyvek®, including a first panel and a second panel foldable over said first panel for closing the package, and an inner component, such as paper, mechanically interlocked with the flexible outer component. A flat medical implant is held by the inner component. While the outer and inner components remains mechanically interconnected to one another, the upper ends of the first and second panels of the outer component are peelable away from one another for opening the package and accessing the flat medical implant at an upper end of the package.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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