Devices and methods for performing a procedure within a spine are disclosed herein. In one embodiment, a method includes coupling a first implant to a pedicle of a first vertebra of a spinal column such that at least a portion of the first implant is disposed between a first spinous process and a second spinous process of the spinal column. A second implant is coupled to a pedicle of a second vertebra of the spinal column. At least a portion of an outer surface of the first implant is configured to contact at least a portion of an outer surface of the second implant when the spinal column is in extension. The outer surface of the first implant and the outer surface of the second implant being at a spaced distance from each other when the spinal column is in flexion.
