Jana Blaesius,Aitor Echaniz,Martin Schoepf,Michael Walther
申请号：
US16633816
公开号：
US20200170657A1
申请日:
2018.07.25
申请国别(地区):
US
年份:
2020
代理人:
摘要：
A method integrates an electrical circuit into a device. The device has an integration surface consisting of a first material. The method includes processing the integration surface in order to form connection elements in order to increase an adhesion of a second material to the integration surface. The second material differs from the first material. The method also includes arranging the electrical circuit adjacent to the processed integration surface. The method furthermore includes applying a volume of the second material at least over the integration surface in order to enclose the electrical circuit in a fluid-tight manner.
