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装置内層流化機構
专利权人:
国立研究開発法人産業技術総合研究所;株式会社ナノテック;株式会社三明
发明人:
原 史朗,前川 仁,横山 泰顕,犬塚 善樹
申请号:
JP20120265075
公开号:
JP6135903(B2)
申请日:
2012.12.04
申请国别(地区):
日本
年份:
2017
代理人:
摘要:
PROBLEM TO BE SOLVED: To create laminar air flow in a small semiconductor manufacturing apparatus without using a HEPA filter.SOLUTION: A cleaning room 210 in an apparatus front chamber 120 which loads and unloads semiconductor wafers to a processing chamber 110 includes an upper punching plate 254 having a plurality of through-holes 1101 for making air supplied from an air supply valve 251 flow therethrough and a lower punching plate 255 having a plurality of through-holes 1102 for making air exhausted from an exhaust valve 253 flow therethrough. Overall height of the apparatus can be reduced because air purified by an external filter is moved in laminar flow through the upper punching plate 254 and the lower punching plate 255 and there is no need to set a HEPA filter in the cleaning room 210 for purification of air and creation of laminar air flow.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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