PROBLEM TO BE SOLVED: To efficiently radiate the heat generated from a heating part of an imaging head.SOLUTION: The imaging device has an imaging element 58 and a flexible circuit substrate 62 connected with the imaging element 58 and folded, and the inner peripheral surface 62b where the flexible circuit substrate 62 is folded has a heating part 75 for heating during the operation of the imaging element 58 and a dummy chip 78 for radiating the heat of the heating part 75 mounted oppositely, and the inner peripheral surface 62b of the flexible circuit substrate 62, the heating part 75, and the dummy chip 78 are sealed with a resin 66 characteristically in a condition that the opposite surfaces 75a, 78a of the heating part 75 and the dummy chip 78 come close or into contact with each other.COPYRIGHT: (C)2012,JPO&INPIT【課題】撮像ヘッドの発熱部品で発生した熱を効率よく放熱すること。【解決手段】撮像素子58と撮像素子58が接続されて折り曲げられたフレキシブル回路基板62とを備え、フレキシブル回路基板62の折り曲げられた内周面62bに、撮像素子58の動作時に発熱する発熱部品75と発熱部品75の熱を放熱するダミーチップ78とが互いに対向して配置され、且つ、発熱部品75及びダミーチップ78の対向面75a、78a同士が互いに近接(又は接触)した状態で、フレキシブル回路基板62の内周面62b、発熱部品75及びダミーチップ78が樹脂66で封止されていることを特徴とする。【選択図】図4
