BOBGAN JEAN M,ENGLISH JAMES M,STIEPER DAVID P,PERCY RICHARD,BARRY PATRICK J,BEAUDET ERNEST,COURI MATTHEW,LAMBERTY MARK A
申请号：
IN201717046925
公开号：
IN201717046925A
申请日:
2017.12.27
申请国别(地区):
IN
年份:
2018
代理人:
摘要：
Aspects of the present disclosure are directed toward apparatuses systems and methods that may comprise a medical device having a header a core assembly and a scaffold assembly. The scaffold assembly may be configured to interface with the core assembly and position and support one or more circuit component relative to one or more other circuit components.
