An apparatus for processing a material by laser, the apparatus comprising: a laser source (14) configured to provide a beam (30) limited diffraction pulsed laser radiation Diffraction device (18) configured to diffract the diffraction limited to generate a diffracted beam (30diff) pulsed laser radiation beam a focusing device (22) configured to focus the diffracted beam on the material and a controller (24) configured to control the diffracted beam in time and space for irradiating the material at a target position with radiation from a set of pulses of radiation of the diffracted beam, so that each of the pulses radiation from the set of pulses of radiation is incident on the target position with a portion in cross section of the diffracted beam, including cross-sectional portion maximum local intensity of the diffracted beam, wherein the portions in cross section of the beam to least a subset of the pulses of the set each include a maximum of different local intensity, wherein at least a subset of maximum local intensity of the diffracted beam is distributed along a line, and wherein the controller is configured to control the diffracted beam to move the beam along the target position in the direction of the line.Un aparato para procesar por láser un material, comprendiendo el aparato: una fuente de láser (14) configurada para proporcionar un haz (30) limitado en difracción de radiación láser pulsada un dispositivo de difracción (18) configurado para difractar el haz limitado en difracción para generar un haz difractado (30diff) de radiación láser pulsada un dispositivo de enfoque (22) configurado para enfocar el haz difractado sobre el material y un controlador (24), configurado para controlar el haz difractado en el tiempo y el espacio para irradiar el material en una posición diana con radiación procedente de un conjunto de pulsos de radiación del haz difractado, de modo que cada uno de los pulsos de radiación procedente del conjunto de pulsos de radiación es i
