Mechanically bistable thermal devices and methods of utilizing the same. The mechanically bistable thermal devices include a mechanically bistable element and a thermal element. The mechanically bistable element is configured to be selectively transitioned between a straight conformation, in which the mechanically bistable element defines an elongate shape, and a wrapped conformation, in which the mechanically bistable element defines an arcuate shape and is configured to at least partially encircle an encircled form. The thermal element is configured to exchange thermal energy with the encircled form when in thermal contact with the encircled form and includes a thermal material that includes a fluid and/or a granular solid. The methods include activating the thermal element and transitioning the mechanically bistable element from the straight conformation to the wrapped conformation to at least partially encircle the encircled form with the mechanically bistable device.