The present disclosure relates to a patch device attached to a head to apply electrical stimulation to a brain, comprising, in accordance with one exemplary embodiment of the present invention, a flexible board comprising a first side and a second side placed on the opposite of the first side, bendable along with a curve of the head； a stimulation control circuit formed on the first side of the flexible board and controlling a current applied to a plurality of adhesion portion； a cover layer formed on the stimulation control circuit in order to cover the first side； and a plurality of adhesion portion adhered to the head when the patch device is attached to the head, formed on the second side of the flexible board separately from each other for insulation.
