David Daomin Zhou,Robert J. Greenberg,Jordan Matthew Neysmith,Boon-Khai Ng,James Singleton Little,Neil Hamilton Talbot,Satinderpall Singh Pannu,James Courtney Davidson,Phillipe John Tabada
申请号：
US12163658
公开号：
US08209023B2
申请日:
2008.06.27
申请国别(地区):
US
年份:
2012
代理人:
摘要：
A flexible circuit electrode array and method of fabrication having a polymer base layer metal traces deposited on the polymer base layer, including electrodes to stimulate tissue a polymer top layer deposited on the polymer base layer and metal traces and a coating of the base and top layer by a soft polymer. A method of preparing a flexible circuit electrode array, comprising: providing a first soft polymer layer depositing a first a base layer on the first soft polymer layer providing a metal thin film on the base layer depositing a top polymer layer on the metal thin film providing holes in the top polymer layer depositing a second soft polymer layer on the top polymer layer providing holes in the second soft polymer layer for bond pads and electrodes and preparing electrodes in the provided holes.
