A plant growing kit has a stand-up package for postal transmission containing soil (19) and seeds. The package has a first (10) and second (12) wall sheet and a bottom sheet (14), with a space between the first (10) and second (12) sheets that contains the soil (19). The second wall sheet (12) comprises a first (30) and second (32) layer joined to each other along a closed perimeter, the seeds being located between the first (30) and second (32) layer. A postal address label for filling in a postal address may be provided. A perforation (16) is provided preferably through the first wall sheet (10), the perforation (16) allowing for the escape of air from said space. The perforation (16) is preferably located in the first wall sheet (10) above a top level that will be assumed by the soil (19) when the package is made to stand upright resting on the bottom edges of the sheets.