The present invention relates to an apparatus for cutting-out including a device for treating a L.A.S.E.R. beam generated by a femtosecond laser (1), and positioned downstream from said femtosecond laser, the treatment device comprising:a shaping system (3) positioned on the trajectory of said beam, for modulating the phase of the wave front of the L.A.S.E.R. beam according to a modulation set value calculated for distributing the energy of the L.A.S.E.R. beam in at least two impact points forming a pattern in its focal plane,an optical focusing system (5) downstream from the shaping system, the optical focusing system comprising a concentrator module for focusing the phase-modulated L.A.S.E.R. beam in a focusing plane and a depth-positioning module for displacing the focusing plane into a plurality of cutting-out planes,a sweeping optical scanner (4) positioned between the concentrator module and the depth-positioning module for displacing the pattern in the cutting-out plane in a plurality of positions.
