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Apparatus for indirect bonding of orthodontic appliances
专利权人:
发明人:
申请号:
EP09168467.0
公开号:
EP2113220B1
申请日:
2004.04.15
申请国别(地区):
EP
年份:
2013
代理人:
摘要:
An indirect bonding apparatus is made by initially placing spacer material (26) over a replica (24) of the patients tooth structure. A tray (30) is then formed over the spacer material and hardened. Next, the spacer material is removed from the tooth replica and orthodontic appliances (34) are placed on the replica at desired locations. A matrix material (40) is placed between the tray and the replica and allowed to harden. Optionally, the apparatus includes features for facilitating removal of the transfer apparatus after the bonding procedure has been completed, and features for applying firm, uniform pressure to the appliances during the bonding procedure. Other aspects of indirect bonding are also described.
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中国工程科技知识中心
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