A patch package structure which includes: a package including a first sheet material which is planar and a second sheet material which has been molded, a peripheral area of the first sheet material having been sealed to a peripheral area of the second sheet material to constitute the package, and a patch disposed in the package in which the patch includes a backing, a pressure-sensitive adhesive layer formed on at least one side of the backing, and a release liner which protects the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer, the release liner having a weakening line for assisting a removal of the release liner and in which the second sheet material has specific first protrudent part, second protrudent part, third protrudent part and elevated part in a central area thereof except the peripheral area thereof.
