PROBLEM TO BE SOLVED: To provide a housing, an electronic device, a method for manufacturing a housing, and a method for manufacturing an electronic device, which are easy to adhere and hard to peel off. A housing according to an embodiment includes a lower surface portion, an upper surface portion, and a side surface portion. The lower surface portion has a contact surface that comes into contact with the adherend. The upper surface portion is vertically separated from the lower surface portion with the first space interposed therebetween. The side surface portion is provided around the first space and is connected to the upper surface portion and the lower surface portion. The upper surface portion and the side surface portion include a first material. The lower surface portion contains a second material made of a resin softer than the first material. A portion containing the second material is exposed on at least a part of the contact surface. [Selection diagram] Fig. 1【課題】付着させ易く且つ剥がれ難い、筐体、電子機器、筐体の製造方法、及び電子機器の製造方法を提供する。【解決手段】実施形態に係る筐体は、下面部、上面部、及び側面部を備える。前記下面部は、被着体へ接触する接触面を有する。前記上面部は、第１空間を挟んで前記下面部から上下方向に離れている。前記側面部は、前記第１空間の周りに設けられ、前記上面部及び前記下面部と接続されている。前記上面部及び前記側面部は、第１材料を含む。前記下面部は、前記第１材料よりも軟らかい樹脂からなる第２材料を含む。前記接触面の少なくとも一部には、前記第２材料を含む部分が露出している。【選択図】図１
