PROBLEM TO BE SOLVED: To improve the durability of an imaging module.SOLUTION: An image pickup device 20 and multiple circuit components 8 are mounted on a lower surface 1B of a substrate 1. The image pickup device 20 and the multiple circuit components 8 are divided by a dam tape 9, and the divided area is covered by a heat radiation plate 12. A peripheral region of the image pickup device 20 is sealed by resins 11 and 13, and peripheral regions of the multiple circuit components 8 are sealed by a resin 10. When the dam tape 9 is removed, a space 9A communicating with the exterior of a substrate module is formed. This structure prevents contact failure of an electric connection part that is caused by expansion etc. of a cavity due to module external air pressure changes and improves the durability.
