Provided are an imaging unit, an imaging module, and an endoscope system capable of obtaining a high-quality image while reducing the diameter of the distal end of an insertion portion. The image pickup unit 10 according to the present invention has an image pickup device, has a semiconductor package 20 in which a connection electrode 21 is formed on the f2 surface, and connection electrodes 31 and 33 on the f3 and f4 surfaces. A first laminated substrate 30 connected to the semiconductor package 20； a second laminated substrate 40 connected to the first laminated substrate 30 such that the laminated direction of the first laminated substrate 30 is orthogonal to the laminated direction； The electronic component 51 mounted inside the first multilayer substrate 30 and the cable 60 connected to the second multilayer substrate 40, the first multilayer substrate 30 and the second multilayer substrate 40 are: The second multilayer substrate 40 is connected to the first multilayer substrate 30 to form a T shape, and is within the projection plane in the optical axis direction of the semiconductor package 20.挿入部先端の細径化を図りながら、高画質の画像を得ることのできる撮像ユニット、撮像モジュールおよび内視鏡システムを提供する。本発明における撮像ユニット１０は、撮像素子を有し、ｆ２面に接続電極２１が形成された半導体パッケージ２０と、ｆ３面およびｆ４面に接続電極３１、３３を有し、接続電極３１を介して半導体パッケージ２０に接続される第１の積層基板３０と、第１の積層基板３０の積層方向と積層方向が直交するように、第１の積層基板３０に接続される第２の積層基板４０と、第１の積層基板３０の内部に実装される電子部品５１と、第２の積層基板４０に接続されるケーブル６０と、を備え、第１の積層基板３０と第２の積層基板４０は、第２の積層基板４０が第１の積層基板３０に接続されてＴ字状をなし、半導体パッケージ２０の光軸方向の投影面内に収まることを特徴とする。
