もなか皮の製造型
- 专利权人:
- 株式会社ライジンテック
- 发明人:
- 小川 滋隆
- 申请号：
- JP2005261346
- 公开号：
- JP4915640B2
- 申请日:
- 2005.09.08
- 申请国别(地区):
- JP
- 年份:
- 2012
- 代理人:
- 摘要：
PROBLEM TO BE SOLVED: To enhance quality of wafer for monaka (bean-jam-filled wafer) without swelling out blown out burrs from a production mold and without leaving burnt deposit.
SOLUTION: The preparation mold 20 comprises concave grooves 7 corresponding to 4 peripheral sections, a female mold 1 and a male mold 11 both having concave grooves 17. (a) Monaka dough 22 is put into a concave section 2 of the female mold. (b) When the female mold 1 and the male mold 11 are closed during baking, housed sections 19 are formed by the concave grooves 7 and the concave grooves 17. The excessive monaka dough 23 jets out of steam through-holes 5 of the female mold 1, is housed in the housed sections 19 and remains within the preparation mold 20. After finishing the baking, the preparation mold 20 is opened and the blown out burrs 26 are removed. Thus, the monaka wafer 25 corresponding to the concave section 2 and a protrusion section 12 is finished.
COPYRIGHT: (C)2007,JPO&INPIT
- 来源网站：
- 中国工程科技知识中心
