Stephanie M. Whited,Siddharth Ram Athreya,Mridula Kapur,Alexander Stolarz,Adrianna Velasquez
申请号：
US16768294
公开号：
US20200299491A1
申请日:
2018.12.11
申请国别(地区):
US
年份:
2020
代理人:
摘要：
The present disclosure provides formulation. The formulation contains a high density polyethylene composition containing (i) a high molecular weight component including an ethylene/a-olefin copolymer, the high molecular weight component having a density from 0.924 to 0.930 g/cc and a high load melt index (121) from 0.3 to 0.9 g/10 min； and (ii) a low molecular weight component including an ethylene-based polymer selected from the group consisting of an ethylene homopolymer and an ethylene/a-olefin copolymer. The high density polyethylene composition has (a) a density from 0.950 to 0.956 g/cc； (b) a high load melt index (121) from 15 to 28 g/10 min； (c) an 121/12 of at least 85； (d) a notched constant tensile load failure time at 35% yield stress of greater than 90 hours； and (e) an environmental stress crack resistance (ESCR) F0 value, according to ASTM D1693-condition B (100% IGEPAL), of greater than 2,000 hours.
