The present invention relates to a process for introducing perforations (30) in a laminate (11) that comprises a silicone gel (40). The process according to the present invention, in particular, comprises the following steps: (iii) bringing an array of perforating elements (13) in contact with a deformable layer (20) of a laminate (11) that at least comprises a substrate layer (50), a layer comprising a silicone gel (40) and a deformable layer (20), wherein said deformable layer (20) covers said layer comprising silicone gel (40)； (iv) applying ultrasonic energy to said laminate (11) in order to simultaneously introduce a plurality of perforations (30) into said laminate (11), while providing deformed portions in said deformable layer (20), wherein said deformed portions penetrate into the plurality of perforations (30) in said laminate (11)； (v) after having introduced said plurality of perforations (30) into said laminate (11), i.e. after step (iv), keeping said deformable layer (20) in contact with said layer comprising silicone gel (40), such that said deformed portions remain penetrating into said plurality of perforations (30), for at least 12 hours, preferably at least 24 hours, further preferably at least 36 hours, further preferably at least 48 hours.
