A method for producing silicon microneedle arrays with drilled holes includes producing a silicon microneedle array. For each microneedle in a plurality of microneedles in the microneedle array, a laser is positioned relative to a microneedle and a drilled hole is drilled into the microneedle array by laser drilling. The drilled holes are drilled in microneedles, in flanks of the microneedles or alongside microneedles. A microneedle array includes a substrate composed of a micromechanical semiconductor material. The microneedle array has microneedles that project from the substrate and has drilled holes. The microneedles are composed of a porous micromechanical semiconductor material.
