An encapsulation system is provided comprising nitrogen-purge, instant bonding encapsulation method. Specifically, the encapsulation system comprises a composition, a two-piece capsule comprising a capsule cap and a capsule body； a gas to purge oxygen from the composition within the capsule； and a sealing solution to seal the capsule cap to the capsule body. Associated methods for encapsulating compositions using the encapsulation system are also provided.
