The present invention relates to a wound care dressing and package assembly. The assembly includes a first package substrate or layer to which a wound care dressing is attached. The wound care dressing includes a backing layer and a contact layer. A release structure is in contact with the contact layer on a side of the contact layer opposite the wound care dressing. The release structure is supported by a second package substrate or layer. A seal interconnects the first and second package layers, forming a sealed volume in which at least the wound care dressing and the release structure is contained. The wound care dressing advantageously releases from the backing layer at low forces, e.g., less than about 1N/linear inch.
