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Ultrasonic transducer element package, ultrasonic transducer element chip, probe, probe head, electronic device, ultrasonic diagnostic apparatus, and method for producing ultrasonic transducer element package
专利权人:
发明人:
申请号:
EP13172012.0
公开号:
EP2684617A1
申请日:
2013.06.14
申请国别(地区):
EP
年份:
2014
代理人:
摘要:
An ultrasonic transducer element package (17) includes a first substrate (32), a second substrate (32), a support body (18), a first ultrasonic transducer and a second ultrasonic transducer. The first substrate (32) has a first opening (43) and a second opening (43) that are aligned in a first direction. The second substrate (32) has a third opening (43) and a fourth opening (43) that are aligned in the first direction. The support body (18) supports the first substrate (32) and the second substrate (32). The first substrate (32) and the second substrate (32) are aligned in a second direction that intersects with the first direction, with a space there between. The first ultrasonic transducer element (28) and the second ultrasonic transducer element (28) are configured at the first opening (43) and the second opening (43) respectively.
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中国工程科技知识中心
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