A head unit for an ultrasonic probe includes a connecting section, an element chip and a storing section. The connecting section is configured to electrically connect the head unit to a probe main body of the ultrasonic probe. The element chip includes an ultrasonic element array having a substrate defining a plurality of openings arranged in an array pattern and a plurality of ultrasonic transducer elements with each of the ultrasonic transducer elements being provided in each of the openings. The element chip is configured to be electrically connected to a processing device of the probe main body through the connecting section. The storing section is configured to store operation setting information of the processing device to be output to the processing device through the connecting section.
