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Laser processing apparatus, osseointegration method, implant material, and implant-material fabrication method
专利权人:
Masaru Kanaoka;Shigeru Tadano;Tooru Murai;Taira Ogita;Masahiro Todoh
发明人:
Masaru Kanaoka,Taira Ogita,Tooru Murai,Shigeru Tadano,Masahiro Todoh
申请号:
US12438264
公开号:
US09192418B2
申请日:
2007.08.21
申请国别(地区):
US
年份:
2015
代理人:
摘要:
A method of integrating bone and implant material includes drilling a hole in either one of the bone and the implant material through to a junction of the bone and the implant material by applying a laser beam to either one of the bone and the implant material and integrating the bone and the implant material by applying a laser beam to the junction through the hole drilled at the drilling.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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