The invention relates to a method for manufacturing a fingerprint sensing device (200) comprising a sensing chip (202) comprising an array of capacitive sensing elements (204). A coating material (205) is arranged in a layer on top of the array of sensing elements (204) forming a plurality of cavities (206) wherein locations of the cavities (206) correspond to locations of the sensing elements (204). Adjacent cavities are connected via channels (306 308) or openings (306 308) in the walls of the cavities (206) allowing for a liquid mold material (208) to flow between the cavities (206) during compression molding. The dielectric constant of the mold material (208) is higher than the dielectric constant of the coating material (205) in order to focus the electromagnetic field lines towards the sensing element (204). The invention also relates to a fingerprint sensing device (200).
