A measurement sensor package and a measurement sensor improve reliability in strength and other aspects. A measurement sensor package (11) includes a substrate (2), a lid (3), a ground conductor layer (4), a metallic thin layer (5), and a bond (6). The ground conductor layer (4) and the metallic thin layer (5) are arranged inside the bond (6) that extends continuously as viewed through from above. The bond (6) directly bonds a first main surface (21) of a substrate body (20) and a facing surface (3a) of the lid (3) together along the entire periphery. This improves the reliability in strength.
