The present invention provides an electrode assembly for attachment to an orthotic device. It includes an electrode carrier. An adhesive layer is removably attached to the electrode carrier. A conductive signal transmission element, e.g. wire, transmits a signal to the electrode assembly. A conductive material layer is attached to the conductive signal transmission element that maintains electrical and mechanical integrity during use within the orthotic device. A conductive pad layer attached to the conductive material layer. One preferred embodiment incorporates a wire including an unexposed portion； and, a conductive attachment means. The electrode assembly preferably includes perforations to facilitate the transmission and evaporation of perspiration or facilitate signal transmission.
