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Plasma treatment method
专利权人:
发明人:
Yuichiro Imanishi,Naohiro Shimizu
申请号:
US14603659
公开号:
US09415127B2
申请日:
2015.01.23
申请国别(地区):
US
年份:
2016
代理人:
摘要:
In a plasma treatment method, at least a surface of a target object is treated using a plasma treatment apparatus at least including a discharge electrode section configured to cause electric discharge based on supply of a high voltage pulse from a pulse power supply, by supplying fluid including nitrogen into the discharge electrode section to generate plasma by electric discharge in the discharge electrode section and applying resultant active species and the fluid to the target object. The flow rate of the fluid is in a range of 20 mm/s to 500 mm/s. Electrical energy per area of the discharge electrode section in the pulse power supply is 1.4×104 (J/cm2) or more. The separation distance from the center of the discharge electrode section to the target object is in a range of 3 mm to 1700 mm.
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