熱伝導性変形性凝集体、熱伝導性樹脂組成物、熱伝導部材、及びその製造方法

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专利权人:

東洋インキＳＣホールディングス株式会社

发明人:

坂本 大気,中里 睦,坂口 香織,岸 大将

申请号：

JP20130137747

公开号：

JP6107479(B2)

申请日:

2013.07.01

申请国别(地区):

日本

年份:

2017

代理人:

摘要：

PROBLEM TO BE SOLVED: To provide a thermally conductive member having high thermal conductivity and excellent film-formability and substrate followability, and a thermally conductive resin composition for producing an adhesive sheet excellent in heat resistance.SOLUTION: An easily deformable aggregate (D) contains 100 pts.wt of thermally conductive particles (A) having an average primary particle size of 0.1-10 μm, and 0.1-30 pts.wt of an organic binder (B) having a reactive functional group; and has an average particle size of 2-100 μm, and an average compressive force required for a compression deformation rate of 10% of 5 mN or less.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/