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Hot melt adhesive
专利权人:
HENKEL AG & CO. KGAA
发明人:
Kentarou Inoue,Masahiro Moriguchi,Naohiro Maeda
申请号:
US15598426
公开号:
US10138400B2
申请日:
2017.05.18
申请国别(地区):
US
年份:
2018
代理人:
摘要:
Problem to be solved of the present invention is to provide a hot-melt adhesive agent which is capable of applying at low temperature, has an excellent adhesiveness at low temperature, and a disposable product obtained by employing the hot-melt adhesive agent. Means for solving the problem is a hot-melt adhesive agent comprised of a thermoplastic block copolymer (A) which is a copolymer of vinyl class aromatic hydrocarbons and conjugated diene compounds, wherein the thermoplastic block copolymer (A) comprises a radial type styrene block copolymer having a styrene content of 35 to 45% by weight and a diblock content of 50 to 90% by weight, and having a viscosity at 25° C. as a 25% (by weight) toluene solution of not more than 250 mPa·s (A1).
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/
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